Automatic SMT SMD LED QFN BGA Soldering Repair Machine With Hot Air & Infrared.

Opis

 BGA Chip Rework

BGA Chip Rework

Model: DH-A2

1.Application Of Automatic

Solder, reball, desoldering different kind of chips: BGA,PGA,POP,BQFP,QFN,SOT223,PLCC,TQFP,TDFN,TSOP, 

 

2.Advantage of Hot Air Automatic

BGA Chip Rework

 

3.Technical data of laser positioning Automatic

 

5300W
Hot air 1200W
Hot air 1200W.Infrared 2700W
AC220V±10% 50/60Hz
L530*W670*H790 mm
V-groove PCB support, and with external universal fixture
±2 degree
Max 450*490 mm,Min 22*22 mm
Workbench fine-tuning ±15mm forward/backward,±15mm right/left
80*80-1*1mm
0.15mm
1(optional)
70kg

 

4.Structures of Infrared CCD Camera Automatic

 

ic desoldering machine

chip desoldering machine

pcb desoldering machine

 

5.Why Hot air reflow

motherboard desoldering machinemobile phone desoldering machine

 

6.Certificate of Optical Alignment Automatic Ball Joint Repair Machine

UL, E-MARK, CCC, FCC, CE ROHS certificates. Meanwhile, to improve and perfect the quality system, 

Dinghua has passed ISO, GMP, FCCA, C-TPAT on-site audit certification.

pace bga rework station

 

7.Packing & Shipment of CCD Camera Automatic

Packing Lisk-brochure

 

 

8.Shipment for 

 

 

9. Related Knowledge of Automatic Infrared Soldering Repair Machine

1,Field-effect transistors (FETs) have the advantages of high input impedance and low noise, making them widely used in various electronic devices. Especially when used as the input stage in an electronic device, FETs offer performance that is difficult to achieve with standard transistors.

2,FETs are divided into two types: junction type and insulated-gate type, but the control principle for both is the same.

  1. FETs are voltage-controlled devices, whereas transistors are current-controlled devices. In situations where the signal source can only provide a small current, an FET should be used. However, when the signal voltage is low and current needs to be drawn from the signal source, a transistor should be selected.
  2. FETs can operate under very low current and low voltage conditions, and their manufacturing process allows for the integration of many FETs on a single silicon chip. This makes them widely used in large-scale integrated circuits.

 

 

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